Semiconductor Manufacturing & Packaging Equipment
HYRNUS provides semiconductor manufacturing, packaging and testing equipment for research, pilot production and mass-production applications. Our equipment portfolio covers multiple processes from wafer preparation and die attachment to wire bonding, molding, inspection, testing and final sorting.
In addition to standalone semiconductor equipment, HYRNUS provides equipment configuration and integrated production line solutions for semiconductor manufacturing and electronic component packaging.
Plan the production process, equipment layout, material flow and workstation configuration based on the available factory space, target capacity and automation requirements.
Develop a suitable process flow according to the device type, package structure, materials and manufacturing requirements, covering key processes such as die attach, wire bonding, molding, inspection, testing and sorting.
Select and configure suitable machines based on production capacity, material compatibility, positioning accuracy, process control, automation level and data traceability requirements.
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